The State Key Laboratory of Radio Frequency Heterogeneous Integration (hereinafter referred to as the Laboratory) was approved by the relevant state ministries and commissions in 2022. The Laboratory is led by Shenzhen University and co-constructed by Shanghai Jiao Tong University and ZTE Corporation. The laboratory focuses on the key scientific and technological issues in the field of RF heterogeneous integration, 1) cross-scale carrier-electromagnetic-thermal-stress multi-physical properties coupling and evolutionary laws, 2) multi-performance multi-functional synergistic mechanism and measurability principles, 3) the generation of heterogeneous interfaces and quantitative regulation mechanism of the process, etc. The laboratory will carry out systematic and in-depth original and forward-looking basic research and core technology research to understand the basic principles, master theories and core technologies, form RF heterogeneous integration capabilities, platforms and standards, and develop a series of RF heterogeneous integrated circuit systems for the country's major needs. The research of the laboratory will promote the development of integrated circuits to change lanes and the rapid progress of information system integration technology, realize the change and leap from integrated circuits to integrated systems, and make significant contributions to the leapfrog development of China's integrated circuit industry, especially the RF heterogeneous heterostructure integration industry. At present, the main research directions of the laboratory include: 1) coupled multiphysics field theory and design methodology; 2) RF heterogeneous heterostructure integration process; 3) testability and test characterization; 4) RF heterogeneous heterostructure integration technology applications, etc.

The laboratory has undertaken dozens of national major scientific and technological tasks in the field of RF integrated circuits and electronic packaging integration. Including China's first 973 program in the field of electronic packaging (project "Basic Research on System-level Packaging"), the National Key Research and Development Program (project "6G high-density RF front-end technology"), the first project in the field of electromagnetic RF technology, and the first project of the National Natural Fund of China Basic Science Center (project "Millimeter-wave Heterogeneous Heterostructure Integrated Circuits"). The laboratory has published more than 1,000 papers in Science, Nature Photonics, IEEE and other top international journals, especially the first paper in the field of electronic packaging and integration published in the famous JSSCC in 2022; These research results have been adopted by the "International Roadmap for the Development of Semiconductor Technology (ITRS)" three times for use in the fields of semiconductors, mobile communications, artificial intelligence, aerospace, national defense technology and other fields more than 200 users, EDA software developed and exported to a number of well-known multinational enterprises, for the implementation of a number of major national projects and the development of national defense equipment to make a positive contribution.

The first director of the laboratory, Academician Junfa Mao, is one of the leading personnel and discipline leaders in the field of heterogeneous heterostructure integration, and has carried out research on heterogeneous heterostructure integration technology earlier in the world, as well as being an IEEE Fellow, and the chairman of Microwave Branch of the Chinese Institute of Electronics (CIE). The director of the first academic committee of the laboratory is Liu Ming, an academician of the Chinese Academy of Sciences. At present, the fixed staff of the laboratory includes 4 academicians of the two academies, 3 academicians of developed countries, 41 national leaders or young talents, the laboratory personnel team has a reasonable structure, a strong sense of innovation and ability, and a spirit of mission and responsibility.

The main laboratory is located in the Science and Technology Park Building, Yuehai Campus of Shenzhen University, of which, the ultra-clean experimental environment has a planned area of about 1,800 square meters, and the testing laboratory and office area is about 10,000 square meters. The laboratory is well-equipped with advanced equipment and systems such as high-precision RF test systems, wafer bonding/debonding systems, advanced packaging equipment, photolithography systems, magnetron sputtering coating systems, chemical vapor deposition systems, atomic layer deposition systems, thin film heat treatment equipment, etching equipment, and material/structural characterization equipment, etc., with a total value of more than 300 million RMB.