​RF heterogeneous integrated circuits operate at high frequency and are generally three-dimensional high-density integration, the close coupling and interaction of carrier transport, electromagnetic, thermal and stress fields are the basic physical effects that determine the behavior and performance of circuits, and it is necessary to first establish a coupled multiphysics field theory to understand the multiphysics coupling, evolutionary laws and regulation mechanisms in circuit analysis and design, process manufacturing and testing and verification, and on this basis study the design methodology of RF heterogeneous integrated circuits, which mainly includes circuit modeling and simulation, device-level fusion design, circuit-level multi-function, multi-physics automation, intelligent co-design, heat dissipation design and thermal management. On this basis, the design methodology of RF heterogeneous integrated circuits is studied, which mainly includes...

There are large performance differences between different semiconductor materials, such as the lattice and expansion coefficient mismatch at heterogeneous interfaces, and it is necessary to solve the problem of heterogeneous interface dynamics, to recognize the interface generation and fusion mechanisms, such as material diffusion, nucleation, adhesion, and eutectic, as well as the interface regulation mechanisms, such as the regulation of the work function, and the regulation of the contact characteristics. On the other hand, the parameter adjustment of the commonly used heterogeneous heterostructure integration process will be restricted by the changes of electromagnetic, thermal, stress and other physical properties of the circuit, and it is necessary to recognize the relationship between process parameters and physical properties, to establish the physical basis of the heterogeneous heterostructure integration process, and to guide the process design and control. ...

RF heterogeneous integrated circuits are realized by a variety of materials, devices, antennas, small chips and even wafers three-dimensional high-density integration, interconnection pitch can be as small as sub-micron, the test and characterization face new challenges, such as three-dimensional high-density heterogeneous integration brings physical node accessibility issues, and high-frequenc...

Focusing on the needs of 6G mobile communications, high-performance computing, radar detection, intelligent unmanned systems, intelligent medical care and other key national development areas, develop a series of RF heterogeneous heterostructure integrated circuit systems and promote their application