Susumu Hoshino (Xujin Wang), academician of the Japanese Academy of Engineering, China's Ministry of Science and Technology Torch Program Talent, Doctor of Engineering, worked overseas for 30 years, returned to China full-time in October 2019, is currently a professor at Shenzhen University, director of the Institute of Microelectronics, director of the Institute of Semiconductor Manufacturing. Academician Susumu Hoshino has been engaged in the research and development of core processes and equipment for micro-nano processing and chip manufacturing for many years at home and abroad, and is an internationally renowned expert in this field. Developed the LED sapphire pad ultra-precision processing technology for the world's first realization of LED mass production made a significant contribution. In the field of semiconductor process, he successfully developed the world's lowest pressure CMP process and equipment for low-k insulating layer flattening, which was highly evaluated by the international CMP industry and won the Technology Award of the Japan Society of Precision Engineers. Developed the world's first tape-type single-layer rigid CMP pad process and realized mass production of CMP process for SoC semiconductor chips. Developed a new 3-layer structure CMP pad that achieves the world's highest overall CMP performance in terms of flatness and uniformity, and realized the mass production of CMP process for DRAM semiconductor memory chips. Successfully developed a new type of optical micro-nano device for on-line inspection of the projection lens of immersion lithography, and realized stable mass production of immersion lithography process for high-end semiconductor chips. Academician Susumu Hoshino has been granted dozens of patents in Japan, the U.S., China, Taiwan, and South Korea.