The National Key Laboratory of RF Heterogeneous Heterostructure Integration (ZTE Corporation) focuses on the research and development and engineering test verification of heterogeneous heterostructure integration technologies such as ultra-large-size, low-loss, low-thermal-resistance, complex 2.5D/3D packages, antenna packages, and opto-electronic co-encapsulation, as well as the development and engineering test verification of technologies such as Sub6G and millimeter-wave RF, to address the needs for high-bandwidth, high-signal-transmission-rate, high-integrated packages and opto-electronic co-encapsulation for the core chips of 5G and the next-generation communications, and to address the needs for low-cost and high-power application scenarios, and solves the problems of engineering verification and mass production application of heterogeneous and heterogeneous integration technologies. The relevant research results are expected to accelerate the realization of heterogeneous heterostructure integration system design, materials, processes and other aspects of the technical results of the transformation of engineering landing, to solve the technical availability, break through the external constraints, and significantly enhance the international competitiveness of China's 5G and next-generation communications chip, to protect the security of the supply chain.

The laboratory has a complete design and simulation platform for advanced packages, realizing rich package types, from frame class to oversized FCBGA to 2.5D/3D package. It supports multi-scenario heat dissipation verification; it has EMI simulation and analysis capability, building common mode source methodology and common mode noise library, near and far field conversion methodology and EMI post-simulation flow.